Paul K. Chu

Paul K. Chu (朱劍豪) is a materials scientist specializing in plasma surface modification and materials science. He is a Chair Professor of Materials Engineering at City University of Hong Kong, with appointments in the Department of Physics, Department of Materials Science and Engineering, and Department of Biomedical Engineering.

Education Chu received a Bachelor of Science degree in mathematics (cum laude) from The Ohio State University in 1977. He obtained his Master of Science and Doctor of Philosophy degrees in chemistry from Cornell University in 1979 and 1982, respectively.

Career and research Chu's research focuses on plasma surface engineering, biomaterials, and nanotechnology. He has held academic positions at City University of Hong Kong and has been involved in international collaborations in materials science.

From 1982 to 1990, he held several positions at Charles Evans & Associates in California. His work during this period involved surface analysis and characterization techniques, in semiconductor materials and research.

Honors and awards Chu is a Fellow of several professional organizations, including the American Physical Society, American Vacuum Society, Institute of Electrical and Electronics Engineers, Materials Research Society, Hong Kong Academy of Engineering, and Hong Kong Institution of Engineers.

Patents Chu holds patents related to materials science and surface engineering.